18 5 月, 2024

Manufacturing

Processing Machinery

Zheng Li, CEO of Changdian Technology: Continuous Innovation in Manufacturing Technology for High Performance Packaging and Carrier Integrated Circuit Products

3 min read

On April 18th, Zheng Li, Director and CEO of Changdian Technology, attended the 25th China Integrated Circuit Manufacturing Annual Conference and Supply Chain Innovation and Development Conference (CICD) Summit Forum and delivered a keynote speech titled “Continuous Innovation in High Performance Packaging and Carrier Integrated Circuit Manufacturing Technology”.

Zheng Li stated that high-performance packaging technology, characterized by heterogeneity and application driven technology, will lead Moore’s Law to a new chapter.
Zheng Li, CEO of Changdian Technology: Continuous Innovation in Manufacturing Technology for High Performance Packaging and Carrier Integrated Circuit Products
High performance packaging reshapes the integrated circuit industry chain
In the signed article Gordon Moore proposed “Moore’s Law” in 1965, he not only predicted the exponential growth of the number of transistors, but also predicted the future technology development direction of integrated circuits that can be packaged with small chips to form large systems. High performance packaging based on microsystem integration was originally an important aspect of Moore’s Law, “Zheng Li pointed out in his speech. The development of chip manufacturing to the stage of high-performance packaging means that the manufacturing of later products has become a core link in the integrated circuit manufacturing industry chain.
For the industry, as the growth mode of integrated circuit performance evolves from transistor miniaturization to system integration driven, the continuous evolution of high performance integrated circuits in the future will rely more on microsystem integration technology. The 2.5D/3D packaging and high-density SiP packaging under the Chiplet architecture are necessary paths for the development of Moore’s Law, and will also become essential and necessary options for the next generation of advanced packaging technology.
At the same time, heterogeneous integration and small chips have also driven changes in design methods, with STCO (System/Technology Collaborative Optimization) becoming an important direction, representing a watershed in chip development from device integration to microsystem integration. STCO achieves the growth of semiconductor integrated circuit performance through system level functional segmentation and re integration, using advanced high-performance packaging as the carrier, and through chip, packaging, and system collaborative optimization.
Application driven high-performance packaging technology innovation
After chip manufacturing enters high-performance packaging, the role of typical applications in technological development has become increasingly significant. Zheng Li pointed out in his speech that in the future dominated by high-performance packaging, different applications will have different requirements for chips and device products. Providing chip manufacturing services driven by applications can not only promote the development of packaging technology and industrial efficiency improvement, but also promote mature technology to feed back more application fields.
For example, in recent years, the mobile device market represented by mobile phones has driven the development of high-performance SiP technology, thereby promoting the application of SiP in other fields; The large-scale high-performance computing platform has promoted the application of optoelectronic encapsulation (CPO), bringing the possibility of chip performance optimization in more fields, all confirming the driving effect of typical applications on high-performance encapsulation.
In the field of high-performance packaging, Changdian Technology has invested a lot of resources in recent years and launched the Chiplet high-performance packaging technology platform XDFOI for high-performance computing and other fields. At present, XDFOI’s 2.5D RDL high-performance packaging has achieved stable mass production, and Changdian Technology is also laying out technology in silicon adapter boards, bridging, and Hybrid bonding.
Zheng Li stated that high-performance packaging carries the continuous innovation direction of chip manufacturing technology and will reshape the development model of the integrated circuit industry. While promoting technological research and development, Changdian Technology will also continuously deepen practical exploration of industrial chain collaboration, enabling high-performance packaging to create greater value for the development of the entire industry.

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